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Thermal Grizzly Conductonaut Thermal Grease Paste - 5.0 Gram Model TG-C-005-R

  • 73 W/mK
  • 10 to 140 C
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Overview
Specs
Reviews (7)

The  Conductonaut  liquid metal thermal paste was developed for applications with high efficiency. The Conductonaut is  recommended as a top product for experienced users who are looking for a solution with the best heat dissipation in the temperature range of over 8 ° C.   The  Conductonaut  liquid metal thermal paste was developed for applications with high efficiency. The Conductonaut is  recommended as a top product for experienced users who are looking for a solution with the best heat dissipation in the temperature range of over 8 ° C.  

Ultra high thermal conductivity
Increased proportion of indium 
Optimal application thanks to plastic needle

Thermal Grizzly Conductonaut is a liquid metal thermal compound based on a eutectic alloy. Thanks to a special mixing ratio of tin, gallium and indium, among others, a very high thermal conductivity is achieved. We recommend applying Conductonaut to nickel-plated copper as this offers the best long-term stability.  

Thermal conductivity 73 W / mk
viscosity 0.0021 Pas
density 6.24 g / cm3
temperature 10 ° C / +140 ° C
content  5 g   


Model: TG-C-005-R

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Warranty, Returns, And Additional Information

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  • Return for refund until: January 31, 2027
  • Return for replacement until: January 31, 2027
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Thermal Grizzly Conductonaut TG-C-005-R is a 5 g liquid thermal compound rated at 73 W/mK, suited to experienced PC builders seeking high heat transfer for compatible CPU or GPU cooling setups; it is electrically conductive and should not be used with aluminum coolers.

Recommended For

  • Experienced desktop overclockers delidding a compatible CPU to reduce the thermal interface between the die and heat spreader, especially when pursuing lower temperatures or more overclocking headroom.
  • Skilled direct-die CPU or GPU builders seeking to improve heat transfer between exposed silicon and a cooler, and who can confirm compatible contact surfaces and protect nearby components.
  • PC enthusiasts with a thermally constrained processor who have verified a compatible copper or nickel-plated cooler surface and want to test whether liquid metal can improve temperatures under sustained workloads.
  • Experienced laptop repair or enthusiast users working on a specific notebook with a compatible cooling assembly and the skills to apply and contain liquid metal carefully.

Real-World Use Scenarios

  • A PC enthusiast delids a compatible desktop CPU and replaces the thermal interface under its heat spreader; benchmark testing shows this can lower CPU temperatures under load, though the improvement depends on the processor and cooling setup.
  • An experienced builder uses Conductonaut between a delidded CPU die and a direct-die cooler to reduce the thermal interface bottleneck; this is a specialized modification, not a routine paste replacement, and requires careful application.
  • An overclocker with a CPU that is thermally limited replaces the interface during a delid to seek more temperature headroom; lower temperatures may help the processor sustain boost or overclock settings, but the compound cannot fix limits caused by the cooler, power settings, or case airflow.
  • A skilled technician services a compatible laptop or GPU that already uses, or is designed for, liquid metal; checking the cooler’s contact material and containing the electrically conductive compound are essential, since a spill or an aluminum cooler can damage hardware.

Spec Summary

AttributeValue
Best ForApplying as a thermal interface compound in cooling setups
Thermal PropertiesThermal conductivity of 73 W/mK; operating temperature range of 10 to 140 C; viscosity of 0.0021 Pas and density of 6.24 g/cm3
Composition And ApplicationLiquid consistency with increased indium content; supplied with a synthetic needle for application; silver in color
Product IdentityThermal Grizzly Conductonaut, model TG-C-005-R, with 5.0 g net weight