Thermal Compound / Grease

(546)

• Volume / Net Weight: 3.5g
• Thermal Conductivity: 3.8 W/mK
• Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds. Net Weight: 3g Thermal Conductivity: 3.8 W/mK Thermal Impedance: 0.01°C -in2/W Viscosity: 2300K cPs Specific Gravity: 2.5g/cm3
• Model #: CT-9010001-WW

(546)

• Volume / Net Weight: 5.0g
• Thermal Conductivity: 5.0 W/mK
• Specifications: Thermal Impedance: 0.009°C -in2/W Viscosity: 2300K cPs Specific Gravity: 2.7g/cm3
• Model #: CT-9010002-WW

• Volume / Net Weight: 1.5g
• Thermal Conductivity: 1.93 W/mK
• Specifications: Bleed < 0.05% at 150 Degree C/24 Hours Evaporation < 0.001% at 150 Degree C/24 Hours Specific Gravity > 1.7 at Degree C Thermal Conductivity > 1.93 W/m-K at 25 Degree C Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F) Color: Silver Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20% Product Length: 2.6 in [67 mm] Product Weight: 0.4 oz [10 g] Product Width: 0.8 in [20 mm] Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
• Model #: SILVGREASE1

• Volume / Net Weight: 20g
• Thermal Conductivity: 1.06 W/mK
• Specifications: Color: White Bleed: <0.05% at 200°C/24 hours Evaporation: <0.001% at 200°C/24 hours Materials: Silicone Compounds 50% Carbon Compounds 20% Metal Oxide Compounds 30% Thermal Resistance: <0.195°C-m2/W Thermal Conductivity: >1.066 W/(m·K)
• Parts: 2 Year
• Model #: HEATGREASE20

• Volume / Net Weight: 3.5g
• Long Term Operating Temperature: -50 to 110 C
• Specifications: Weight: 3.5 g Volume: 1,4 ml Density: 2,49 g/cm3 Colour: Grey
• Model #: NT-H1

• Specifications: Premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink
• Model #: NT-H2 3.5g

• Model #: BZ005

• Specifications: Cleaning Wipes for Thermal Paste
• Model #: NA-SCW1

• Part Number: 4260711990038
• Volume / Net Weight: 1.0g
• Thermal Conductivity: 12.5KW
• Long Term Operating Temperature: -250 °C / +350 °C
• Model #: TG-K-001 RS

• Volume / Net Weight: 5.0g
• Thermal Conductivity: 73 W/mK
• Long Term Operating Temperature: 10 to 140 C
• Specifications: Viscosity: 0.0021 Pas Density: 6.24g/cm3 Consistency: Liquid
• Model #: TG-C-005-R

• Model #: NA-STPG1

• Volume / Net Weight: 3.5g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: < 0.49 micron < 0.000020 inch Extended Temperature Limits: Peak: -50 Celsius Degree to >180 Celsius Degree Long-Term: -50 Celsius Degree to 130 Celsius Degree Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-3.5G

• Volume / Net Weight: 4.0g
• Thermal Conductivity: 8.5 W/mK
• Specifications: Thermal Conductivity (W/mk): 8.5 Viscosity (poise): 870 Density (g/cm3): 2.5 Net Weight: 4g The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer. The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components. The consistency of the ARCTIC MX-4 is designed for simple application. Its text...
• Model #: ACTCP00002B

• Model #: NT-H1 3.5g SW Edition

• Thermal Conductivity: 14.2 W/mK
• Long Term Operating Temperature: -250 °C / +350 °C
• Model #: TG-KE-002 R

• Model #: ACTCP00031B

• Model #: PTM7950-40*80mm-A

• Model #: SILV5THERMALPASTE

• Model #: TG-K-001-RS

• Model #: NT-H1 3.5g AM5 Edition

• Volume / Net Weight: 1.0g
• Thermal Conductivity: 73 Wm / K
• Long Term Operating Temperature: 10 °C -140°C
• Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g
• Model #: Conductonaut 1 Gram

• Volume / Net Weight: 20g
• Model #: ACTCP00001B

• Model #: NT-H2 3.5g AM5 Edition

• Part Number: ACTCP00081A
• Model #: ACTCP00081A

• Volume / Net Weight: 2 x 30ml
• Specifications: Package Specs: 60ml Kit (2 fluid ounces) - 30ml ArctiClean 1 and 30ml ArctiClean 2.
• Model #: ACN-60ML (2-PC-SET)

• Volume / Net Weight: 8.0g
• Model #: ACTCP00008B

• Volume / Net Weight: 12g
• Long Term Operating Temperature: -50 to 130 C
• Specifications: Average Particle Size: <0.49 micron <0.000020 inch Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C Long-Term: -50 Degrees C to 130 Degrees C Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
• Model #: AS5-12G

• Volume / Net Weight: 3ml / 7.8g
• Thermal Conductivity: 11.8 W/mk
• Long Term Operating Temperature: -200 °C / +350 °C
• Specifications: The Hydronaut thermal grease delivers optimal heat transfer capabilities for larger-scale cooling solutions like water cooling systems. Hydronaut thermal grease consists of a silicon-free structure. The makes it very light and highly flexible and easy to apply. Hydronaut achieves best results if used on medium- to large-scale cooling solutions. This product is ROHS-compliant for demanding users.
• Model #: TG-H-030-R

• Volume / Net Weight: 1.5ml/3.9 g
• Thermal Conductivity: 8.5 W/mK
• Long Term Operating Temperature: -150 °C / +200 °C
• Specifications: Even though the amount of metallic elements in Aeronauts formula is lower in comparison to our other products, it still provides reliable and perfomant thermal conductivity. In our lab tests, Aeronaut showed a high amount of wear resistance under high temperatures, and acts also surface-protecting. The removal of Aeronaut thermal grease causes far less micro scratches on the components surface compared to other products.
• Model #: TG-A-015-R

• Volume / Net Weight: 45g
• Thermal Conductivity: 8.5 W/mK
• Specifications: Thermal Conductivity: 8.5 W/(mK) Viscosity: 870 poise Density: 2.50 g/cm³ Volume Resistivity: 3.8 x 1013 O-cm
• Model #: ACTCP00024A

Limited time offer, ends 01/30

• Model #: 11-001-338

• Volume / Net Weight: 15g
• Thermal Conductivity: 12.8 W/mK,
• Long Term Operating Temperature: -40 C to +400C
• Specifications: Color:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
• Model #: Thermalright Thermal Pad 85x45x2mm

Limited time offer, ends 01/30

• Model #: 11-001-341

• Volume / Net Weight: 5.0g
• Thermal Conductivity: 11.0 W/mK
• Long Term Operating Temperature: -150 to 130 C
• Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.
• Model #: TG-K-015-R

(9)

• Volume / Net Weight: 4.0g
• Thermal Conductivity: 11.0 W/mK
• Model #: MGZ-NDSG-N15M-R1

• Model #: Heilos-AMD