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TF9 Thermal Paste 14W/m.k Heat Sink Compound 1.5g, High Durability, for All heatsinks CPU Coolers, with Tool (1.5g) for Thermalright TF9
- High thermal conductivity
- Safe application
- High durability
- Easy to apply
- Thermal compound
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Overview
Specs
Reviews (7)
Easy to Apply With an ideal consistency, the TF8 is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler.
Excellent Performance TF8 Thermal Conductivity: 13.8 W/mK (MX-4 is only 8.5 W/mk). The heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking. Safe Application It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compound, it ensures that contact with any electrical pins would not result in damage of any sort. TF8 2 Grams With tool
Thermal Conductivity: 13.8 W/mK
Excellent Performance TF8 Thermal Conductivity: 13.8 W/mK (MX-4 is only 8.5 W/mk). The heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking. Safe Application It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compound, it ensures that contact with any electrical pins would not result in damage of any sort. TF8 2 Grams With tool
Thermal Conductivity: 13.8 W/mK
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 90 days
- This item is covered by Corn Electronics Return Policy
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