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Corn Electronics
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9SIADDZK2W5131
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Thermalright Heilos (8.5W/m.k /30*40*0.2MM) Processor Thermal Pad Heilos Solid Thermal lnterface Sheet for Intel LGA 115X/1200/1700
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Option:
30 x 30mm
30 x 30mm
40 x 40mm
30*40*0.2mm
LGA115X/1200/1700
Thermal conductivity: 8.5W/mK
Thermal resistivity: 0.04°Ccm2/W
Resistivity:2.1x100,000,000,000,000cm
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Overview
Specs
Reviews
30*40* 0.2 mm
LGA115X/1200/1700
Thermal conductivity
: 8.5W /mK
Thermal resistivity
: 0.04 °Ccm2/W
Resistivity
: 2.1 x100, 000, 000, 000, 000cm
Learn more about the Detailed Specifications
Additional Information
First Listed on Newegg
August 13, 2023
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Return for refund within: 30 days
Return for replacement within: 90 days
This item is covered by
Corn Electronics Return Policy
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