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GY-87 10DOF MPU6050 HMC5883L BMP180 Low-Field Magnetic Sensor Module Milli-Gauss to 8 Gauss and 1° to 2° Compass Heading Accuracy
- The HMC5883L is a surface-mount, multi-chip module designed for low-field magnetic sensing with a digital interface for applications such as lowcost compassing and magnetometry.; 3-Axis Magnetoresistive Sensors and ASIC in a 3.0x3.0x0.9mm LCC Surface Mount Package. 12-Bit ADC Coupled with Low Noise AMR Sensors Achieves 5 milli-gauss Resolution in ±8 Gauss Fields. Sensors Can Be Used in Strong Magnetic Field Environments with a 1° to 2° Degree Compass Heading Accuracy.; I2C Digital Interface. Built-In Self Test. Fast 160 Hz Maximum Output Rate. Popular Two-Wire Serial Data Interface for Consumer Electronics. Enables Low-Cost Functionality Test after Assembly in Production.; Power Management This device has two different domains of power supply. The first one is VDD that is the power supply for internal operations and the second one is VDDIO that is dedicated to IO interface. It is possible to work with VDDIO equal to VDD; Single Supply mode, or with VDDIO lower than VDD allowing HMC5883L to be compatible with other devices on board.; MODES OF OPERATIONContinuous-Measurement Mode, Single-Measurement Mode(default power-up mode),Idle Mode.; Reflow AssemblyThis device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow profile is required for HMC5883L, which is compatible with lead eutectic and lead-free solder paste reflow prof
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Overview
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The HMC5883L is a surface-mount, multi-chip module designed for low-field magnetic sensing with a digital interface for applications such as lowcost compassing and magnetometry.; 3-Axis Magnetoresistive Sensors and ASIC in a 3.0 x 3.0 x 0.9 mm LCC Surface Mount Package. 12-Bit ADC Coupled with Low Noise AMR Sensors Achieves 5 milli-gauss Resolution in ±8 Gauss Fields. Sensors Can Be Used in Strong Magnetic Field Environments with a 1° to 2° Degree Compass Heading Accuracy.; I2C Digital Interface. Built-In Self Test. Fast 160 Hz Maximum Output Rate. Popular Two-Wire Serial Data Interface for Consumer Electronics.
Enables Low-Cost Functionality Test after Assembly in Production.; Power Management This device has two different domains of power supply. The first one is VDD that is the power supply for internal operations and the second one is VDDIO that is dedicated to IO interface. It is possible to work with VDDIO equal to VDD; Single Supply mode, or with VDDIO lower than VDD allowing HMC5883L to be compatible with other devices on board.; MODES OF OPERATIONContinuous-Measurement Mode, Single-Measurement Mode(default power-up mode), Idle Mode.; Reflow AssemblyThis device is classified as MSL 3 with 260 C peak reflow temperature.
A baking process (125 C, 24 hrs) is required if device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow profile is required for HMC5883L, which is compatible with lead eutectic and lead-free solder paste reflow prof
Enables Low-Cost Functionality Test after Assembly in Production.; Power Management This device has two different domains of power supply. The first one is VDD that is the power supply for internal operations and the second one is VDDIO that is dedicated to IO interface. It is possible to work with VDDIO equal to VDD; Single Supply mode, or with VDDIO lower than VDD allowing HMC5883L to be compatible with other devices on board.; MODES OF OPERATIONContinuous-Measurement Mode, Single-Measurement Mode(default power-up mode), Idle Mode.; Reflow AssemblyThis device is classified as MSL 3 with 260 C peak reflow temperature.
A baking process (125 C, 24 hrs) is required if device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow profile is required for HMC5883L, which is compatible with lead eutectic and lead-free solder paste reflow prof
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