The mold is opened according to the industry standard size of the floppy,matching the front panel specifications of the chassis.
The metal bracket is stamped and formed to the overall rigidity,and the panel is sandblasted to oxidation and the texture.
The properly designed screw fixing holes are for various chassis installations.
The USB3.0 high-speed cable conductor is tin-plated,and the three-layer shielding enhances the stability of high-speed data transmission.The USB2.0 adds a filter capacitor to make the power supply more stable.
Reasonably the layout of the panel to that each device can be inserted normally.