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Enermax ETC521 Thermal Compound 3.0g

  • Optimized polymer matrix to help reduce pump out
  • Flowable
  • Good thermal conductivity
  • Low thermal resistance
  • Non-curing, no need for curing ovens
  • Heat removal from electronics components
  • Can achieve thin Bond Line Thickness (BLT)
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Overview
Specs
Reviews (1)
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The Enermax ETC521 thermal compound features high thermal conductivity, no electrical conductivity and no corrosive property. Easily apply it on your CPU to transfer more heat from your CPU to the base plate of the heat sink you installed. It comes in a small resealable syringe and once applied, it can be used for years. It is the go-to choice for gamers and overclockers.


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  • High thermal conductivity
  • No electrical conductivity
  • Non corrosive
  • Easy to apply
  • Resealable
  • Long lasting

Warranty & Returns

Warranty, Returns, And Additional Information

Warranty

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