ASUS TUF GAMING B860M-PLUS WIFI Motherboard & Intel Ultra 5 245K CPU Combo,B860 LGA 1851 mATX motherboard, Intel Core Ultra Series 2 Ready, AI PC, 12+1+2+1 80A stages, DDR5 ,PCIe 5.0, 3x M.2, Wi-Fi 7

Motherboard & CPU & Thermal grease Combo

Motherboard: TUF GAMING B860M-PLUS WIFI

Ready for Advanced AI PC: Designed for the future of AI computing, with the power and connectivity needed for demanding AI applications

Intel LGA 1851 Socket: Ready for Intel Core Ultra Processors (Series 2)

Enhanced Power Solution: 12+2+1 80A DrMOS power stages, 8+8 pin ProCool power connectors, alloy chokes and durable capacitors for stable power delivery

Optimized Thermal Design: Large VRM heatsinks, M.2 and PCH heatsinks, hybrid fan headers and Fan Xpert 4

Latest M.2 Support: One onboard PCIe 5.0 M.2 slot and two PCIe 4.0 M.2 slots, all with M.2 heatsink

Ultrafast Connectivity: PCIe 5.0 x16 slot, rear USB 20Gbps Type-C port with DP Alt mode, front USB 10Gbps Type-C connector

High-Performance Networking: On-board Wi-Fi 7 (802.11be) and Realtek 2.5 Gb Ethernet

DIY Friendly Design: PCIe Slot Q-Release, M.2 Q-Latch, Q-Antenna, Q-Dashboard, Q-LED, BIOS FlashBack and Pre-mounted I/O shield

CPU: Intel Ultra 5 245K

3nm (TSMC N3B) Arrow Lake 125W

24MB L3 Cache

26MB L2 Cache

Intel Graphics

Cooling device not included - Processor Only

Thermal grease: Shin-Etsu X-23-7868-2D

Coefficient of thermal conductivity:6.2 (W/m.k)

Thermal resistance :0.07 (°C*cm^2 7W)

Paste Color: Gray

Viscosity: 100 (Pa.s)

Replacement cycle: Suggested 2 years (Official lifespan 3-5 years)

Application difficulty: Easy to apply

Suggested Group: Suitable