With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
High thermal conductivity. Low thermal resistance. Non-corrosive. Best thermal stability in high temperature. Excellent adhesion. Preserve in room temperature for longer lifespan.
Learn more about the Cooler Master RG-ICFN-200G-B1
Model
Brand
COOLER MASTER
Series
IceFusion 200G Value Pack
Model
RG-ICFN-200G-B1
Details
Volume / Net Weight
200g
Thermal Conductivity
1.22 W/mK
Specifications
Color: White Specific Gravity @ 25°C: >2.5 Dielectric Constant: >5.1 at 100Hz Dissipation Factor: <0.005 at 100Hz Temperature Stability (°C): -50 ~ 24°C Thermal Conductivity (W/m-K): >1.22 Net Weight: 200 grams / 0.44lbs
Features
Features
System builder value size contains enough compound for 500 applications
Resealable package
High thermal conductivity.
Low thermal resistance.
Non-corrosive.
Best thermal stability in high temperature.
Excellent adhesion.
Preserve in room temperature for longer lifespan.
Additional Information
First Listed on Newegg
February 24, 2010
Customer Reviews of the Cooler Master RG-ICFN-200G-B1