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Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream New Arrival
- Good Quality
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Overview
Specs
Reviews
Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream New Arrival
Description:
Feature:
It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.
The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 - 10 uses.
Specification:
Thermal Conductivity: > 3.8 W/m*K
Thermal Impedance: < 0.087 degC- in²/W
Specific Gravity: > 2.5
Thixotropic Index: 380 +/-10
Working Temperature: -50 -340degC
Package Includes:
1 x Thermal Conductive Grease
Description:
Feature:
It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.
The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 - 10 uses.
Specification:
Thermal Conductivity: > 3.8 W/m*K
Thermal Impedance: < 0.087 degC- in²/W
Specific Gravity: > 2.5
Thixotropic Index: 380 +/-10
Working Temperature: -50 -340degC
Package Includes:
1 x Thermal Conductive Grease
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 15 days
- Return for replacement within: 30 days
- This item is covered by Hetai Return Policy
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