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Size SCYTHE FUMA3 Twin Tower Side Flow CPU Cooler with Double Reverse Type Fan
- The 2.4 inch (6 mm) diameter x 6 heat pipes and twin tower design that heats up to 2 blocks, achieves high-end class performance. Fin design with improved compatibility with LGA1700 new retention back plate has been changed to metal
- Offset design with a thin 0.6 inch (15 mm) thick fan in the front and the heat sink design is moved back and cut on the top of the fins and rear to reduce interference with the structure on the motherboard for improved compatibility
- Compact design with a low height of 6.1 inches (154 mm) and a black sandblasted top cover mounted on the top of the heatsink
- The "double reverse method" allows the front fan to rotate counterclockwise and the middle fan is clockwise. Reduces airflow turbulence, increased airflow and static pressure characteristics. Reduces airflow turbulence, improves airflow and static pressure properties
- Intel: 1150 / 1151 / 1155 / 1156 / 1200 / 1700 / 2011 / 2011 (V3) / 2066 AMD: AM4 / AM5 compatible
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Overview
Specs
Reviews
The 2.4 inch (6 mm) diameter x 6 heat pipes and twin tower design that heats up to 2 blocks, achieves high-end class performance. Fin design with improved compatibility with LGA1700 new retention back plate has been changed to metal
Offset design with a thin 0.6 inch (15 mm) thick fan in the front and the heat sink design is moved back and cut on the top of the fins and rear to reduce interference with the structure on the motherboard for improved compatibility
Compact design with a low height of 6.1 inches (154 mm) and a black sandblasted top cover mounted on the top of the heatsink
The "double reverse method" allows the front fan to rotate counterclockwise and the middle fan is clockwise. Reduces airflow turbulence, increased airflow and static pressure characteristics. Reduces airflow turbulence, improves airflow and static pressure properties
Intel: 1150 / 1151 / 1155 / 1156 / 1200 / 1700 / 2011 / 2011 (V3) / 2066 AMD: AM4 / AM5 compatible
Offset design with a thin 0.6 inch (15 mm) thick fan in the front and the heat sink design is moved back and cut on the top of the fins and rear to reduce interference with the structure on the motherboard for improved compatibility
Compact design with a low height of 6.1 inches (154 mm) and a black sandblasted top cover mounted on the top of the heatsink
The "double reverse method" allows the front fan to rotate counterclockwise and the middle fan is clockwise. Reduces airflow turbulence, increased airflow and static pressure characteristics. Reduces airflow turbulence, improves airflow and static pressure properties
Intel: 1150 / 1151 / 1155 / 1156 / 1200 / 1700 / 2011 / 2011 (V3) / 2066 AMD: AM4 / AM5 compatible
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- Return for refund within: 30 days
- Return for replacement within: 90 days
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