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Dynatron Q7 1U Copper Vapor Chamber Heatsink with Stacked Fins for LGA 1700 Socket
- Supports Intel Alder Lake-S Socket LGA 1700
- Copper Vapor Chamber Heatsink with Stacked Fins
- Supports up to 125W TDP
- Pre-applied Shin-Etsu 7762 Thermal Grease
- Dimensions: 3.74" x 3.7" x 1.11"
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Overview
Specs
Reviews
Recommend for Intel Alder Lake S Processor, Socket LGA 1700, Copper Vapor Heatsink with Stacked Fins. Support 125 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.
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- Return for refund within: 30 days
- Return for replacement within: 30 days
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