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    Dynatron Q7 1U Copper Vapor Chamber Heatsink with Stacked Fins for LGA 1700 Socket

    • Supports Intel Alder Lake-S Socket LGA 1700
    • Copper Vapor Chamber Heatsink with Stacked Fins
    • Supports up to 125W TDP
    • Pre-applied Shin-Etsu 7762 Thermal Grease
    • Dimensions: 3.74" x 3.7" x 1.11"
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    Overview
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    Reviews
    Recommend for Intel Alder Lake S Processor, Socket LGA 1700, Copper Vapor Heatsink with Stacked Fins. Support 125 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

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