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G.SKILL Ares Series 8GB (2 x 4GB) DDR3 2133 (PC3 17000) Desktop Memory Model F3-2133C9D-8GAB
- DDR3 2133 (PC3 17000)
- Timing 9-11-10
- CAS Latency CL9
- Voltage 1.65V
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Overview
Specs
Reviews (19)
G.SKILL ARES is built for ultra-high performance with rock solid stability. Rated at DDR3 2133 speed and at 9-11-10-28 timings, the ARES memory kit F3-2133C9D-8GAB serves and powers your system in your daily battles of gaming and computing. Extensive tests ensure peace of mind reliability. The low-profile heat spreader allows installation in systems even with a small form factor. Intel XMP support makes overclocking a breeze.
Ultra High Performance and Solid ReliabilityRated at 2133MHz at 9-11-10-28, the super-sized 8GB ARES memory kit F3-2133C9D-8GAB delivers up to 17.0GBps per channel to ensure outstanding performance. It is ideal for current operating systems and applications. Passing extensive reliability and compatibility tests with a wide range of Intel and AMD platforms, the ARES memory kit ensures solid reliability while maintaining overclocking headroom.
Low-Profile Heat Spreader DesignThese memory modules feature an advanced heat spreader for super heat transfer and dissipation. At only 3.2cm tall, the low-profile heat spreader is ideal for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts.
Intel XMP SupportThe G.SKILL Ares Series F3-2133C10D-8GAB memory kit comes with the latest Intel XMP standard for second- and third-generation Intel Core processors. It provides PC enthusiasts with an easy overclocking experience.
Ultra High Performance and Solid ReliabilityRated at 2133MHz at 9-11-10-28, the super-sized 8GB ARES memory kit F3-2133C9D-8GAB delivers up to 17.0GBps per channel to ensure outstanding performance. It is ideal for current operating systems and applications. Passing extensive reliability and compatibility tests with a wide range of Intel and AMD platforms, the ARES memory kit ensures solid reliability while maintaining overclocking headroom.
Low-Profile Heat Spreader DesignThese memory modules feature an advanced heat spreader for super heat transfer and dissipation. At only 3.2cm tall, the low-profile heat spreader is ideal for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts.
Intel XMP SupportThe G.SKILL Ares Series F3-2133C10D-8GAB memory kit comes with the latest Intel XMP standard for second- and third-generation Intel Core processors. It provides PC enthusiasts with an easy overclocking experience.Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Hot Deals 4 Less Return Policy
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