Features | H.D.T (Heat-pipe Direct Touch) technology.
Stealth Technology; Low Heat Signature Ceramic Coating, larger heat dissipating area.
Tower side flow design, efficient and optimal cooling performance.
Anti-vibration rubbers prevent vibration and absorb noise.
Dual fan capability.
Equipped with multiple clips to support Intel LGA 2011 / 1366 / 1156 / 1155 / 775 and AMD FM1 / AM3 / AM2+ / AM2.
High Performance 3 x 8mm heat pipe design, way superior than 4 x 6mm heat pipe. |
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