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BGA Reballing Universal Stencil BGA Rework Net Stencil Template Solder Steel Mesh Directly Heat Set Kit 0.3mm 0.35mm 0.375mm 0.4mm 0.5mm Phone BGA IC Chips Repair Tool
Limited time offer, ends 11/01 By Kepler Forge
- FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.; POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.; COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.; VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.; STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.
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Overview
Specs
Reviews
Specification: Item
Type: BGA
Reballing Stencil Pitch: 0.3 mm/ 0.012 in, 0.35 mm/ 0.014 in, 0.375 mm/ 0.015 in, 0.4 / 0.016 in, 0.5 mm/ 0.020 in
Product Material: Stainless Steel
Package List: 1 x BGA Reballing Stencil
Type: BGA
Reballing Stencil Pitch: 0.3 mm/ 0.012 in, 0.35 mm/ 0.014 in, 0.375 mm/ 0.015 in, 0.4 / 0.016 in, 0.5 mm/ 0.020 in
Product Material: Stainless Steel
Package List: 1 x BGA Reballing Stencil
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 90 days
- This item is covered by Kepler Forge Return Policy
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