COMPACT SIZE: The BGA63 bounding adapter features a compact design, making it easy to handle and use with any MS version. Its small size ensures portability and convenience for on-the-go repairs and programming tasks.
EASY CONNECTION: Simply connect the BGA63 adapter to the USB SD card reader on your PC or laptop. The recovery software will guide you through the data restoration process, ensuring a seamless and user-friendly experience.
VERSATILE COMPATIBILITY: This BGA63 adapter comes with three limit frames, suitable for IC sizes of 11x9mm, 11x10mm, and 13x10.5mm. It supports ICs with 0.8-1.5mm thickness and 0.5mm pin pitch, offering broad application range.
ICSP INTERFACE: The BGA63 bounding adapter boasts a unique serial ICSP interface, enabling both serial download and high-speed parallel high-voltage programming. This feature ensures efficient and reliable performance for various programming needs.
DURABLE CONSTRUCTION: Made from high-quality PEI and PES materials, the BGA63 adapter operates within a temperature range of -55 to 170. With a product life of over 30,000 uses, it is built to last for long-term reliability.