MEG X570S ACE MAX
OUTSTANDING COOLING SOLUTION
Aluminum Cover with 7W/mK Thermal Pad
A full aluminum IO cover and extended heatsink design provides large heat dissipation surface.
Double Side M.2 Shield Frozr
Sustain maximum high-speed M.2 SSD data transfer with M.2 SHIELD FROZR and prevent SSD thermal throttling with a double-sided sandwiching thermal design.
An aluminum baseplate cools down your Mosfet with a dedicated thermal pad.
Connects the two MOS heatsinks to enlarge the heat dissipation surface.
The updated chipset heatsink is enlarged and fanless.
MEG X570S ACE MAX
Featuring the latest wireless solution, delivering speeds up to 2400Mbps on the 6GHz spectrum and supports MU-MIMO and BSS color technology.
Lightning USB 20G
Ultra-fast rear USB Type-C port transfer speeds up to 20Gb/s powered by the ASMedia ASM3241 USB 3.2 Gen2x2 controller.
M.2 XPANDER-Z GEN4 S
Add two extra M.2 slots for ultra-fast SSDs and sustain maximum transfer speeds with the smart fan cooling design.
Onboard 2.5 Gigabit Ethernet LAN with LAN manager.
The memory circuit design has been optimized on a reserved section of the motherboard fully isolated from other circuits.
Quadruple M.2 Connectors
Four onboard M.2 connectors for high-speed storage performance.
MEG X570S ACE MAX
stable cornerstone of your system
Pre-installed I/O Shield
Protect the IO ports from potential electrostatic discharge damage from the external environment.
PCIe Steel Armor
Reinforced and shielded PCIe slots for strength and stability.
Direct 16+2 Phases with 90A Smart Power Stage
Extreme direct power solution with 16+2 phases and 90A Smart Power Stage to reliably drive the CPU even during heavy workloads.
2oz Thickened Copper
An enhanced PCB material design improves heat dissipation and high-performance capabilities.
Server Grade PCB
Server-grade multilayer printed circuit boards are optimized for high power delivery and fast transfer speeds.
DIRECT 16+2 PHASES WITH 90A SMART POWER STAGE
MEG X570S ACE MAX features a premium power layout with direct 16+2 phases with 90A Smart Power Stage parts, Titanium Choke III, and dual CPU power connectors to unleash and sustain maximum processor performance.
THERMAL SOLUTION FOR HIGH PERFORMANCE MULTI CORE PROCESSORS
MEG X570S ACE MAX features Aluminum Cover, VRM Heat-pipe, 7W/mK thermal pads, Double-sided M.2 Shield Frozr and MOSFET Baseplate to keep temperatures in check and let the motherboard sustain extreme performance.
LIGHTNING GEN 4 SOLUTION
Strike fast with MSI Lightning Gen 4 PCI-E. Attach ultra fast PCI-E 4.0 devices and enjoy up to 64GB/s unidirectional transfer bandwidth. PCIe 4.0 maintains both backward and forward compatibility with older and newer specifications.
QUADRUPLE M.2 WITH DOUBLE SIDE M.2 SHIELD FROZR
MEG X570S ACE MAX features four onboard M.2 connectors for high-speed SSDs.
M.2 XPANDER-Z GEN 4 S
This PCI-Express card offers two extra M.2 slots with smart fan cooling, features auto detect function for M.2 access and the M.2 temperature for easy checking.
Ultra-Fast Lightning USB 20G
Connect the rear USB Type-C port and quickly move large files including uncompressed video, raw images, and bulky simulation data across USB 3.2 Gen 2x2 with transfer speeds up to 20Gbps.
PRE-INSTALLED IO SHIELD
Pre-Installed IO Shielding makes handling the motherboard process easier and safer. The design is grounded and protects the IO ports from potential electrostatic discharge damage from the external environment.
WI-FI 6E & BLUETOOTH
Connect to a high-speed Wi-Fi network with onboard Wi-Fi 6E. OFDMA and two-way MU-MIMO technology optimize data transmission and deliver speeds up to 2.4Gbps.
MAXIMIUM DATA TRANSFER WITH 2.5G LAN
MEG X570S ACE MAX features onboard 2.5Gbps Ethernet LAN, for gamers and power users who demand high-bandwidth and low-latency network connectivity. Prioritize latency-sensitive applications with MSI LAN Manager for a superior online experience.
PCB WITH 2OZ THICKENED COPPER
An enhanced PCB material design with 2oz thickened copper increases conductivity, improving heat dissipation and high-performance reliability.
SERVER GRADE PCB
To fully support the latest PCI-E Gen 4 solution which features twice the transfer speed and bandwidth, MEG X570S ACE MAX motherboards adopt server grade PCB that provide reliable and long-lasting system performance for the lengthiest of gaming sessions.
1. Standard PCB construction
2. Server grade PCB construction
3. - Offers up to 3 times heat resistance, keeps PCB stable when high temperature
- Prevents PCB bending by stronger construction for the system foundation
- Reduces up to 30% signal loss for the better performance
UNMATCHED MEMORY PERFORMANCE
MSI takes memory stability and performance to the extreme. The memory circuit layout has been optimized for reliability and tested extensively in partnership with major memory manufacturers for compatibility.
CUSTOMIZE YOUR GAMING RIG
Personalize your PC with RGB LED lighting capable of 16.8 million colors with dynamic effects through the Mystic Light APP.
AMPLIFY YOUR EXPERIENCE WITH AUDIO BOOST 5 HD
Like a dedicated sound card, Audio Boost 5 HD offers a premium audio processor, ESS audio DAC, dedicated amplifier and high quality audio capacitors all physically isolated from the rest of the motherboard circuitry to ensure the purest audio signal to locate enemies with pin-point accuracy. Powered by ALC 4082 audio processor, this motherboard supports 120dB SNR, 32-bit/384kHz game-changing studio grade sound.
MULTIPLE GPU SUPPORT AND PCI-E STEEL ARMOR
MEG X570S ACE MAX supports both NVIDIA SLI and AMD CrossFire multi GPU technologies. PCI-E slot placements provide optimal airflow for graphics card cooling. MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points and support the weight of heavy graphics cards. When every advantage counts, Steel Armor shields the point of contact from electromagnetic interference.