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Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles impr...
Features: Unique 2-Step Process:
ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU and/or heatsink so that it can easily be removed with a clean cloth or paper towel. A few drops of ArctiClean 2 Thermal Surface Purifier and some gentle wiping then removes the remaining residue and inhibits flash corrosion on copper or aluminum.
ArctiClean 1 Thermal Material Remover:
ArctiClean 1 uses a proprietary combination of non-toxic biodegradable solvents to emulsify thermal greases or thermal pads. The citrus and soy based solvents in ArctiClean 1 match or exceed many hazardsous and volatile solvents such as fluorinated and chlorinated organic solvents, acetone, MEK (methyl ethyl ketone), mineral spi...
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: Characteristics:
Arctic Alumina Adhesive uses a layered
composite of aluminum oxide and boron nitride.
Temperature range:
- 40C to >150C (Bond strength is slightly weakened at temperatures below 0C due to crystallization.)
Pure Electrical Insulator:
Arctic Alumina Adhesive is a pure electrical
insulator, neither electrically conductive nor capacitive.
Compliancy: RoHS Compliant.
Specifications: Average Particle Size:
<0.36 micron <0.000014 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Temperature Limits:
Peak: -150 Degrees C to >185 Degrees C
Long-Term: -150 Degrees C to 130 Degrees C
Coverage Area:
2.7-gram syringe. (Approximately 1cc)
At a layer 0.003" thick, one syringe will cover about 22 square inches.
25-gram syringe. (Approximately 9.2cc)
At a layer 0.003" thick, one syringe will cover about 200 square inches.
Features: Tri-Linear Ceramic Content:
Like the original Ceramique, Ceramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically-sized particles and new ultra-high shear mixing tech...
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles impr...
Features: Low thermal resistance for superior heat transfer, 4.5W/mK
Small molecular size makes a better contact between the heatsink and heatsource.
Thin bond line for hi-efficiency conductivity
Low bleed under high pressure
Help the low-pressure clip design of cooler to achieve better cooling performance.
RoHS compliant
Not Electrically conductive
Specifications: Average Particle Size:
<0.39 micron <0.000015 inch (65 particles lined up in a row equal 1/1000th of an inch.
Temperature Limits:
Peak: -40 degree to >160 degree
Long-Term: -40 degree to 125 degree
Coverage Area:
1.75-gram syringe. (Approximately 1cc)
At a layer 0.003" thick, one syringe will cover about 24 square inches.
14-gram syringe. (Approximately 9cc)
At a layer 0.003" thick, one syringe will cover about 192 square inches.
Features: Absolute Stability:
Arctic Alumina will not separate, run, migrate, or bleed.
Electrical Insulator:
Arctic Alumina does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or th...
Specifications: Thermal Conductivity (W/mk): 8.5
Viscosity (poise): 870
Density (g/cm3): 2.5
Net Weight: 4g
The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU/GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.
The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components.
The consistency of the ARCTIC MX-4 is designed for simple application. Its texture is just thin enough to spread onto components using fingers without...
Features: Better performance than TX-3 thermal grease.
Easy apply than TX-3 thermal grease
6.53W/mK Ultra-High thermal conductivity for superior heat transfer
Tends to form a thinner layer between CPU and heatsink than other greases even under low pressure
Helps the low-pressure clip design of cooler to achieve better cooling performance
RoHS compliant
Low bleed under high pressure
Not electrically conductive
High stability and reliability
Best solution for the heatpipe direct contact or heatpipe direct touch type CPU cooler.(Ex: Sunbeam Core Contact Freezer)
Features: Characteristics:
Made with 99.8% pure micronized silver. 62% to 65% silver content by weight. Superior thermal performance.
Temperature Range:
- 40C to >150C (Bond strength is slightly weakened at temperatures below 0C due to crystallization.)
Negligible Electrical Conductivity:
Arctic Silver Thermal Adhesive was formulated to conduct heat, not electricity. NOTE: Even though Arctic Silver Thermal Adhesive is specifically engineered for high electrical resistance, it should be kept away from electrical traces, pins, and leads. The cured adhesive is slightly capacitive and could potentially cause problems if it bridged two close-proximity electrical paths.
Compliancy: RoHS Compliant.
Components:
A set of Arctic Silver Thermal Adhesive consists of two syringes containing a total of 7 grams of adhesive (3.5 grams each of parts
A and B) and a plas...
Specifications: Color: White
Specific Gravity @ 25°C: >2.5
Dielectric Constant: >5.1 at 100Hz
Dissipation Factor: <0.005 at 100Hz
Temperature Stability (°C): -50 ~ 24°C
Thermal Conductivity (W/m-K): >1.22
Net Weight: 200 grams / 0.44lbs
Features: System builder value size contains enough compound for 500 applications
Resealable package
High thermal conductivity.
Low thermal resistance.
Non-corrosive.
Best thermal stability in high temperature.
Excellent adhesion.
Preserve in room temperature for longer lifespan.
Specifications: Color: White
Specific Gravity @ 25°C: >2.5
Dielectric Constant: >5.1 at 100Hz
Dissipation Factor: <0.005 at 100Hz
Temperature Stability (°C): -50 ~ 24°C
Thermal Conductivity (W/m-K): >1.22
Net Weight: 40 grams / 1.41 ounces
Features: Contains enough compound for 100 applications
Reseal able package
High thermal conductivity.
Low thermal resistance.
Non-corrosive.
Best thermal stability in high temperature.
Easy Application with Included Applicator Blade.
Preserves in room temperature for longer lifespan.
Features: Extreme Performance
Ultra low thermal resistance and superior heat conductance maintain the highest performance level of heat transfer between the heat source and heatsink for maximized cooling performance.
Convenient Application and Storage
The syringe applicator provides convenience during storage and applicationon a variety of computer components such as the CPU, GPU, and Northbridge chipset.
High Safety Standards
The composition is dielectric (electrically nonconducting) to prevent electrical hazards and complies with the RoHS (Restriction of Hazardous Substances) standards for the highest level of safety.
Specifications: Form: 1 Part
Color: White
Viscosity/Flowability: Nonflowing
Specific Gravity (cured): 2.37
Shelf Life: 24 months from DOM
Dielectric Constant: 4.4 at 100k Hz
Dissipation Factor 0.02 at 100k Hz
Dielectric Strength: 550 volts/mil; 21.7 kV/mm
Features: Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Dielectric.
Wide range of application temperature.
Features: High thermal conductivity & high penetrability.
Excellent stability and under a wide range of temperatures and operating conditions.
Stable consistency.
4 pcs in 1 package provides more convenient application and store up.
(STC-01) is a silicone-free thermal grease for use in high performance CPU’s and GPU’s.
Contents: Thermal compound x 4 Spreader x 1
Color: white
Thermal conductivity: 3.8W/mK
Work temperature: -50°C~150°C
Thermal Resistance: 0.017c-in2/W
Weight: 1g x 4
Features: Ultimate Heat Conductivity
Non-Electrical Conductive
Non-Corrosive & Non-Curring
No Bleeding & User Friendly
GELID Applicator
Net Content of 3.5g
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